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Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth
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Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition Hardcover - 2014 - 6th Edition

by Peter Van Zant

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  • Title Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition
  • Author Peter Van Zant
  • Binding Hardcover
  • Edition number 6th
  • Edition 6
  • Condition Used - Acceptable
  • Pages 576
  • Volumes 1
  • Language ENG
  • Publisher McGraw-Hill Companies
  • Date 2014-01-07
  • Illustrated Yes
  • Features Bibliography, Glossary, Illustrated, Index, Table of Contents, Textbook
  • Bookseller's Inventory # A0071821015
  • ISBN 9780071821018 / 0071821015
  • Weight 2.4 lbs (1.09 kg)
  • Dimensions 9.5 x 7.3 x 1.3 in (24.13 x 18.54 x 3.30 cm)
  • Library of Congress subjects Integrated circuits - Design and construction, Semiconductors - Design and construction
  • Library of Congress Catalog Number 2013043733
  • Dewey Decimal Code 621.381

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From the publisher

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The most complete, current guide to semiconductor processing

Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.

State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.

COVERAGE INCLUDES:

  • The semiconductor industry
  • Properties of semiconductor materials and chemicals
  • Crystal growth and silicon wafer preparation
  • Wafer fabrication and packaging
  • Contamination control
  • Productivity and process yields
  • Oxidation
  • The ten-step patterning process--surface preparation to exposure; developing to final inspection
  • Next generation lithography
  • Doping
  • Layer deposition
  • Metallization
  • Process and device evaluation
  • The business of wafer fabrication
  • Devices and integrated circuit formation
  • Integrated circuits
  • Packaging

About the author

Peter Van Zant is an internationally known semiconductor professional with an extensive background in process engineering, training, consulting, and writing. He is the principal of Peter Van Zant Associates, a firm that supplies writing, training, and consulting services to business and industry. Van Zant's books and training materials are used by chip manufacturers, industry suppliers, colleges, and universities. Peter Van Zant Associates' customers have included Intel, National Semiconductor, Applied Materials, Air Products and Chemicals, SCP Global Inc., and a number of educational institutions.

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