Description:
Springer-Verlag Publishing, 2014. 1. Hardcover. Very Good. Very Good+; Hardcover; Covers are still glossy; Unblemished textblock edges; The endpapers and all text pages are bright and unmarked; The binding is tight with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); 1.4 lbs; Red covers with title in white lettering; 2014, Springer-Verlag Publishing; 339 pages; "Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications," by Shichun Qu & Yong Liu.
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications by Qu, Shichun
by Qu, Shichun
Similar copies are shown below.
Similar copies are shown to the right.
Stock Photo: Cover May Be Different
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
by Qu, Shichun
- Used
- Good
- Hardcover
hardcover. Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book.
-
Seller
Bonita
(US)
- Format/Binding Hardcover
- Book Condition Used - Good
- Quantity Available 1
- Binding Hardcover
- ISBN 10 149391555X
- ISBN 13 9781493915552
We have 4 copies available starting at NZ$164.98.
Stock Photo: Cover May Be Different
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
by Qu, Shichun
- Used
- Very Good
- Hardcover
- first
- Condition
- Used - Very Good
- Edition
- 1
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9781493915552 / 149391555X
- Quantity Available
- 1
- Seller
-
Bellingham, Washington, United States
- Item Price
-
NZ$164.98NZ$3.99 shipping to
Show Details
Item Price
NZ$164.98
NZ$3.99
shipping to
Stock Photo: Cover May Be Different
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
by Qu, Shichun
- Used
- Hardcover
- first
- Condition
- New
- Edition
- 1
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9781493915552 / 149391555X
- Quantity Available
- 1
- Seller
-
Bellingham, Washington, United States
- Item Price
-
NZ$181.48NZ$3.99 shipping to
Show Details
Description:
Springer-Verlag Publishing, 2014. 1. Hardcover. Like New. Fine/As New; Hardcover; Covers are still glossy with "sharp" edge-corners; Unblemished textblock edges; The endpapers and text pages are all bright and unmarked; The binding is tight with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); 1.4 lbs; Dark red covers with title in white lettering; 2014, Springer-Verlag Publishing; 339 pages; "Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications," by Shichun Qu & Yong Liu.
Item Price
NZ$181.48
NZ$3.99
shipping to
Stock Photo: Cover May Be Different
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
by Shichun Qu
- New
- Hardcover
- Condition
- New
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9781493915552 / 149391555x
- Quantity Available
- 604
- Seller
-
Uxbridge, Greater London, United Kingdom
- Item Price
-
NZ$259.65NZ$7.99 shipping to
Show Details
Description:
Hard Cover. New. New Book; Fast Shipping from UK; Not signed; Not First Edition; The Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications.
Item Price
NZ$259.65
NZ$7.99
shipping to
Stock Photo: Cover May Be Different
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
by Qu, Shichun (Author)/ Liu, Yong (Author)
- New
- Hardcover
- Condition
- New
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9781493915552 / 149391555X
- Quantity Available
- 2
- Seller
-
Exeter, Devon, United Kingdom
- Item Price
-
NZ$361.03NZ$10.00 shipping to
Show Details
Description:
Springer, 2014. Hardcover. New. 322 pages. 9.25x6.25x1.00 inches.
Item Price
NZ$361.03
NZ$10.00
shipping to