Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
by Pecht, Michael
Available Copies
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
by Pecht, Michael
- Condition
- Used - Near Fine
- Jacket Condition
- Near Fine
- Edition
- First Edition, Second Printing
- Published
- 1994
- Binding
- Hardcover
- ISBN
- 9780471594468
- Quantity Available
- 1
- Seller
-
Nelson, British Columbia, CAN
- Item Price
-
NZ$68.16
Show Details
Description:
New York: Wiley-Interscience, 1994. First Edition, Second Printing. Hardcover. Near Fine/Near Fine. Blue cloth over boards with title stamped in orange onto upper board and spine, 8vo, pp. xxxi, 426, illustrated with charts, tables and diagrams. Clean and unmarked throughout with light wear to jacket. Item Price
NZ$68.16
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
by Pecht, Michael
- Condition
- As New copy in dust jacket
- Edition
- Second Printing
- Published
- 1994
- Binding
- Hardcover
- ISBN
- 9780471594468
- Quantity Available
- 1
- Seller
-
Monterey, California, USA
- Item Price
-
NZ$129.18
Show Details
Description:
New York: Wiley-Interscience, 1994. Second Printing. Hardcover. As New copy in dust jacket. Octavo; xxxi, 426 pages. Item Price
NZ$129.18
