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System-In-Package RF Design and Applications Hardcover - 2006
by Michael P. Gaynor
In the past few years, System-in-Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. This comprehensive resource on SiP design techniques offers designers state-of-the-art packaging know-how.
Details
- Title System-In-Package RF Design and Applications
- Author Michael P. Gaynor
- Binding Hardcover
- Edition First
- Pages 221
- Volumes 1
- Language ENG
- Publisher Artech House Publishers
- Date October 31, 2006
- Illustrated Yes
- Features Bibliography, Illustrated, Index, Table of Contents
- ISBN 9781580539050 / 158053905X
- Weight 0.99 lbs (0.45 kg)
- Dimensions 9.24 x 6.26 x 0.68 in (23.47 x 15.90 x 1.73 cm)
- Library of Congress subjects Multichip modules (Microelectronics) -, Radio frequency integrated circuits - Design
- Dewey Decimal Code 621.381
Media reviews
Citations
- Scitech Book News, 03/01/2007, Page 151