Advanced Electronic Packaging: With Emphasis on Multichip Modules.
by Brown, William D., editor
- Used
- Hardcover
- Condition
- A very good plus copy, no dustjacket.
- Seller
-
Reno, Nevada, United States
Payment Methods Accepted
About This Item
New York. : IEEE Press. , 1999. . Hardcover, glossy pictorial boards.. A very good plus copy, no dustjacket. . 8vo.. Heavy book, requires extra postage.
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Details
- Bookseller
- Zephyr Books (US)
- Bookseller's Inventory #
- 281352
- Title
- Advanced Electronic Packaging: With Emphasis on Multichip Modules.
- Author
- Brown, William D., editor
- Format/Binding
- Hardcover, glossy pictorial boards.
- Book Condition
- Used - A very good plus copy, no dustjacket.
- Quantity Available
- 1
- Binding
- Hardcover
- Publisher
- IEEE Press.
- Place of Publication
- New York.
- Date Published
- 1999.
- Pages
- xxxii, 789 pp.
- Bookseller catalogs
- Electronics;
- Size
- 8vo.
Terms of Sale
Zephyr Books
30 day return guarantee, with full refund including original shipping costs for up to 30 days after delivery for any reason.
About the Seller
Zephyr Books
Biblio member since 2018
Reno, Nevada
About Zephyr Books
Zephyr Books is owned and operated by Lee and Ivye Johnson. We have been in the book business in Reno, Nevada since 1994. We have operated both brick and mortar, as well as online exclusive shops. We closed our brick and mortar shop in 2013, and now offer an exclusive selection of rare, collectible, and antiquarian books online only.