Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications Paperback - 2016
by Shichun Qu
- New
- Paperback
Description
Standard delivery: 14 to 21 days
Details
- Title Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
- Author Shichun Qu
- Binding Paperback
- Condition New
- Pages 322
- Volumes 1
- Language ENG
- Publisher Springer
- Date 2016
- Bookseller's Inventory # 2-1493954385
- ISBN 9781493954384 / 1493954385
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Themes
- Aspects (Academic): Science/Technology Aspects
- Dewey Decimal Code 621.381
About Revaluation Books Devon, United Kingdom
General bookseller of both fiction and non-fiction.
From the rear cover
This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided.
This book also:
- Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directlybumping technology
- Introduces the development of the analog and power SIP/3D/TSV/stack die packaging technology
- Presents the wafer-level analog IC packaging design through fan-in and fan-out with RDLs
