Wafer-Level Chip-Scale Packaging

Springer-Verlag Publishing, 2014. 1. Hardcover. Very Good. Very Good+; Hardcover; Covers are still glossy; Unblemished textblock edges; The endpapers and all text pages are bright and unmarked; The binding is tight with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); 1.4 lbs; Red covers… Read more about this item

Springer-Verlag Publishing, 2014. 1. Hardcover. Like New. Fine/As New; Hardcover; Covers are still glossy with "sharp" edge-corners; Unblemished textblock edges; The endpapers and text pages are all bright and unmarked; The binding is tight with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); 1.4… Read more about this item

Hard Cover. New. New Book; Fast Shipping from UK; Not signed; Not First Edition; The Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications.

Springer, 2014. Hardcover. New. 322 pages. 9.25x6.25x1.00 inches.

hardcover. Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book.

Springer, 2016. Paperback. New. reprint edition. 339 pages. 9.25x6.10x0.80 inches.