Description:
Newnes, 1993-05-17. Hardcover. Good.
Stock Photo: Cover May Be Different
Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series) Hardcover - 1993
by MOORE
Details
- Title Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series)
- Author MOORE
- Binding Hardcover
- Edition Illustrated
- Publisher Newnes, Boston
- Date 1993-05
- ISBN 9780750692670
More Copies for Sale
Stock Photo: Cover May Be Different
Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series)
by Editor-Thomas M. Moore; Editor-Robert G. McKenna
- Used
- good
- Hardcover
- Condition
- Used - Good
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780750692670 / 0750692677
- Quantity Available
- 1
- Seller
-
HOUSTON, Texas, United States
- Item Price
-
NZ$35.41FREE shipping to USA
Show Details
Item Price
NZ$35.41
FREE shipping to USA
Stock Photo: Cover May Be Different
Characterization of Integrated Circuit Packaging Materials
by Moore, Thomas M.
- Used
- Fine
- Hardcover
- Condition
- Used - Fine
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780750692670 / 0750692677
- Quantity Available
- 1
- Seller
-
Vancouver, Washington, United States
- Item Price
-
NZ$85.64NZ$11.06 shipping to USA
Show Details
Description:
Saint Louis, Missouri, U.S.A.: Butterworth-Heinemann, 1993. Hardback in fine condition.. Hardcover. Fine.
Item Price
NZ$85.64
NZ$11.06
shipping to USA