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Characterization of Integrated Circuit Packaging Materials (Materials
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Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series) Hardcover - 1993

by MOORE


Details

  • Title Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series)
  • Author MOORE
  • Binding Hardcover
  • Edition Illustrated
  • Publisher Newnes, Boston
  • Date 1993-05
  • ISBN 9780750692670
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Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series)
Stock Photo: Cover May Be Different

Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series)

by Editor-Thomas M. Moore; Editor-Robert G. McKenna

  • Used
  • good
  • Hardcover
Condition
Used - Good
Binding
Hardcover
ISBN 10 / ISBN 13
9780750692670 / 0750692677
Quantity Available
1
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HOUSTON, Texas, United States
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This seller has earned a 4 of 5 Stars rating from Biblio customers.
Item Price
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Description:
Newnes, 1993-05-17. Hardcover. Good.
Item Price
NZ$35.41
FREE shipping to USA
Characterization of Integrated Circuit Packaging Materials
Stock Photo: Cover May Be Different

Characterization of Integrated Circuit Packaging Materials

by Moore, Thomas M.

  • Used
  • Fine
  • Hardcover
Condition
Used - Fine
Binding
Hardcover
ISBN 10 / ISBN 13
9780750692670 / 0750692677
Quantity Available
1
Seller
Vancouver, Washington, United States
Seller rating:
This seller has earned a 5 of 5 Stars rating from Biblio customers.
Item Price
NZ$85.64
NZ$11.06 shipping to USA

Show Details

Description:
Saint Louis, Missouri, U.S.A.: Butterworth-Heinemann, 1993. Hardback in fine condition.. Hardcover. Fine.
Item Price
NZ$85.64
NZ$11.06 shipping to USA