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Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in
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Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science) Paperback - 2010

by Springer


From the publisher

Chemical Mechanical Planarization (CMP) is fast becoming the established technology for removing unwanted materials after etching from the semiconductor chip surface, as well as for other steps in the manufacturing process. This volume is a comprehensive review of CMP technology in state-of-the-art semiconductor manufacturing. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered, as are polishing tools and consumables. The leading edge issues of damascene and new dielectrics as well as slurryless technology are also developed.

From the rear cover

This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Details

  • Title Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science)
  • Author Springer
  • Binding Paperback
  • Edition Softcover reprin
  • Language ENG
  • Publisher Springer
  • Date 2010-12
  • ISBN 9783642077388
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Chemical-Mechanical Planarization of Semiconductor Materials

Chemical-Mechanical Planarization of Semiconductor Materials

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Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science)
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Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science)

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